| SEM-VIEW | |
 | |
| GRADE DATA | |
| Cu （%） | ≥99.3 |
| C （%） | ≤0.03 |
| N （%） | ≤0.01 |
| H2-Loss（%） | ≤0.60 |
| Apparent Density（g/cm3） | 1.0-1.1 |
| Tap Density（g/cm3） | 1.9-2.1 |
| D10 Laser（um） | 3.0-3.5 |
| D50 Laser（um） | 6.2-6.5 |
| D90 Laser（um） | 10.5-11.5 |
Product Features:
Small particle size, narrow particle size distribution, good particle uniformity, large surface area, good liquidity.
Main Application:
1.Used as foundation powder of diamond tools matrix, promoting sintered alloying, improving the holding force to diamond.
2.The hybrid integrated circuits, capacitors, and other multi-chip wiring, electronic thick-film paste electrode material.
